I-Huawei iphakamisa isu elihlukile lokukhiqiza ama-semiconductor

  • Le nkampani yethula uMthetho we-Tau Scaling kanye nomklamo we-LogicFolding ukuze kuthuthukiswe ama-chip ngaphandle kokuthembela ku-lithography ye-EUV.
  • Bahlose ukufeza ukuminyana kwe-transistor okulingana no-1,4 nm ngo-2031.
  • Kulindeleke ukuthi amaprosesa amasha eKirin aqale ukusebenza kuleli hlobo, okungenzeka ukuthi ahlanganiswe nochungechunge lweMate 90.
  • Le ndlela ibeka phambili isivinini sokudlulisa idatha kanye nokwakheka kwesistimu kunokuncipha okubonakalayo kwe-transistor.

Ama-chips e-Huawei

Isimo sezwe esiyinkimbinkimbi sezombusazwe kanye nemikhawulo ebekwe yi-United States kushukumisele iShayina ukuba ifune izindlela ezihlukile emkhakheni we-microchip. Njengoba ibhekene nokungakwazi ukuthola imishini ye-ultraviolet extreme (EUV) lithography enkampanini yaseDashi i-ASML, iHuawei yethule uhlelo oluyinhloko lokuhlala incintisana ngaphandle kokulandela indlela evamile yemboni.

Ngesikhathi se-International Symposium on Circuits and Systems (ISCAS) 2026 eShanghai, inhloko ye-HiSilicon yembule isiphakamiso sobuchwepheshe esifuna linganisa ukusebenza yezindawo ezithuthuke kakhulu eNtshonalanga. Leli cebo alisekelwe ekuncipheni okukhulu, kodwa ekushintsheni kwendlela ulwazi oluphathwa ngayo ngaphakathi kwe-silicon.

Amaprosesa weHuawei
I-athikili ehlobene:
UHuawei uzokwethula eyakhe i-64-bit 8-core processor

Umthetho we-Tau kanye nomqondo we-LogicFolding

Nakuba imboni ibilokhu iqondiswa amashumi eminyaka yi-Moore's Law, egxile ekunciphiseni usayizi ongokoqobo wama-transistors, entsha Umthetho Wokulinganisa i-Tau Iphakamisa ukuthi kufakwe isikali se-geometric esikhundleni sesikali se-temporal. Kalula nje, umgomo awuseyona nje ukwenza ingxenye ibe ncane, kodwa ukunciphisa isikhathi esithathwayo ukuze idatha ihambe kuyo yonke i-chip.

Ukuze lo mbono uphumelele, inkampani ithuthukise ukwakheka kwezakhiwo Ukugoqwa kwe-LogicLolu hlelo luhilela ukugoqa nokufaka amasekethe e-logic ezakhiweni ezinezingqimba ezimbili, okunciphisa izindlela zokuxhuma zangaphakathi futhi kuthuthukise ukusebenza kahle kwamandla. Ukuqinisekisa ukuthi lokhu kusebenza ngaphandle kokushisa ngokweqile kwedivayisi, iHuawei isebenzise ukulungiswa kwezinga ezine:

  • Isendlalelo esibonakalayo: Ukumelana okuthuthukisiwe kanye nomthamo kuma-transistors.
  • Umklamo wesekethe: Ukunciphisa umthwalo we-capacitive kanye nokwenza ngcono izindlela ezibalulekile.
  • Izinga le-chip: Ukuxhumana okuseduze phakathi kwesofthiwe ne-silicon ukuze kulawulwe ukugeleza kwedatha.
  • Indawo yesistimu: Ukudalwa kwezinqubo ezifana ne-UnifiedBus ukuze kuncishiswe ukubambezeleka.

Ngokwemininingwane enikezwe yinkampani, le ndlela ivumela khulisa ukuminyana kwe-transistor ngo-53,5% uma kuqhathaniswa nemiklamo yendabuko ye-2D, ifinyelela kuma-transistors afinyelela ku-238 million ngemilimitha yesikwele. Lokhu kungabeka amakhono ayo ezingeni lezinqubo ze-TSMC ze-3nm noma i-Intel's Node 18A, yize ochwepheshe bexwayisa ngokuthi iyi- ukuminyana okulinganayo hhayi ngenqubo efanayo yokukhiqiza.

I-DeepSeek V4 yenzelwe ama-chip e-Huawei
I-athikili ehlobene:
I-DeepSeek V4 yenzelwe ama-chips e-Huawei: ukunyakaza okukhulu kwaseShayina ku-AI

Umthelela kumadivayisi e-Kirin kanye nemakethe yaseYurophu

Lokhu kuthuthuka akuyona nje inkolelo-mbono, njengoba iHuawei ithi ikhiqize ama-chip angu-381 ngokusekelwe kulezi zimiso eminyakeni eyisithupha edlule. Igxathu elibonakalayo kakhulu kubasebenzisi lingafika ekwindla ngokwethulwa kwe- Iprosesa ye-Kirin 2026okulindeleke ukuthi kube yinjini yomndeni we-Mate 90. Le hardware entsha kulindeleke ukuthi inikeze Ukwanda kokusebenza okungu-41% kwe-cores yayo kanye nokuthuthuka kwemvamisa ephezulu.

Ngokuhamba kwesikhathi, isifiso senkampani sikhulu kakhulu: bahlose ukufeza ubuningi obufana nobe- Ama-nanometer angu-1,4 ngo-2031Uma bekwazi ukuqinisekisa le ndlela, iHuawei inganciphisa kakhulu ukuthembela kwayo ezinkampanini zakwamanye amazwe futhi iqinise isikhundla sayo emakethe yama-smartphone asezingeni eliphezulu, lapho isiqalile khona ukubuyisa amandla ayo ngokumelene nemikhiqizo efana ne-Apple ezindaweni ezahlukahlukene.

Kodwa-ke, abahlaziyi bemboni baveza ukuthi inselele yangempela kuzoba ukuhumusha le mpumelelo yeselula ibe yi- izikhungo zedatha kanye nobuhlakani bokwenziwaUkuletha ukwakheka kwe-LogicFolding kuma-chip e-AI afana ne-Ascend kuzohilela ukuphatha amazinga okushisa namandla adinga kakhulu, okwenza kube ukuhlolwa okuphelele kobukhosi bobuchwepheshe baseShayina.

Ukugxila kweHuawei ekwenzeni ngcono ukuxhumana kwangaphakathi kanye nesakhiwo sesistimu, kunokuba kulwisane nokulinganiselwa ngokomzimba kwe-lithography, kusetha inkambo lapho ukuqina kobuchwepheshe Lokhu kuba yisikhali sayo esiyinhloko. Ngokugxila ekusebenziseni kahle isikhathi kanye nokubeka izinto ngokwengqondo, inkampani ihlose ukuqinisekisa ukuthi amadivayisi ayo esikhathi esizayo agcina amandla adingekayo ukuze ancintisane neqembu eliphambili lobuchwepheshe bomhlaba.


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